Product Description
Product Overview
UVA28 series is a kind of UV curing peelable adhesive, suitable for circuit board/component coating protection. The gel is a viscous gel state, with high TI, after dispensing can be better to maintain the shape of the dispensing, with a certain base high ability; after curing has the right adhesion, according to different protection scenarios to choose the right adhesion models.
- The curing film has high cohesion & elongation at break, and the gel is not easy to break when removing the glue. Cured adhesive film can resist reflow & T288 immersion tin.
- Suitable for both manual and automatic dispensing.
- Viscosity, adhesion and colour can be adjusted as required.
Major application
Apply to all kinds of mobile phones, glass, metal, plastic, components, solder joints and other temporary protection.
Characteristic indicators | UVA28 | UVA28-NF | Competition **479-B/D** |
Viscosity/mPa.s(5rpm) | ~49000 | ~49000 | ~48000 |
Thixotropic Index/TI (0.5/5rpm) | 4.4 | 4.2 | 4.4 |
Tensile strength/MPa | 3.7 | 4.0 | 3.4 |
Young's modulus/MPa | 2.8 | 2.6 | 2.9 |
Elongation at break/% | 209 | 209 | 185 |
Curing depth /mm(3000mJ) | 2.4 | 2.6 | 1.7 |
90° Peeling Force @PCB/N | 3.1 | 2.6 | 2.8 |
Key words:
UV adhesive | Conductive silver adhesive
Hotline:198-5478-9001
Email:info@szts.tech
Address: 16th Floor, Building A4, China Merchants Science Park, Guangming District
Page keywords: chip solid crystal silver adhesive, low temperature curing conductive silver adhesive, LED solid crystal silver adhesive, isotropic conductive adhesive, semiconductor packaging silver adhesive, high temperature curing conductive silver adhesive, UV light curing adhesive