Product Description
Product overview
UVA06 and UVA11 are a class of UV curing adhesives with good fluidity and high cohesion, UVA21 has moderate fluidity, and UVA30 has good base-high capacity for anodic/micro-arc oxidation masking & temporary protection. The viscosity of the colloid has a wide range, which can be selected according to the customer's needs.
- After curing, it has strong adhesion; at the same time, it has higher cohesion and suitable elongation at break, so that the glue is not easy to break when removing the glue.
- It is suitable for both manual and automatic dispensing; because of its high base and good effect, it is especially suitable for automatic mechanical de-gluing.
- Viscosity, thixotropic index and colour can be adjusted as required.
Major application
Anodising/micro-arc oxidation masking & temporary protection.
Characteristic indicators | UVA06 | UVA11 | UVA21 | UVA30 |
Viscosity/mPa.s(5rpm) | ~3000 | ~4400 | ~22000 | ~67000 |
Thixotropic Index/TI (0.5/5rpm) | 1.0 | 1.8 | 4.6 | 4.3 |
Tensile strength/MPa | 15 | 19.8 | 17.3 | 21.4 |
Young's modulus/MPa | 241 | 238 | 194 | 238 |
Elongation at break/% | 45 | 47 | 177 | 195 |
Curing depth /mm(3000mJ) | 1.3 | 1.5 | 1.4 | 1.4 |
90° Peeling Force @PCB/N | 5.7 | 7.3 | 13.0 | 7.1 |
Key words:
UV adhesive | Conductive silver adhesive
Hotline:198-5478-9001
Email:info@szts.tech
Address: 16th Floor, Building A4, China Merchants Science Park, Guangming District
Page keywords: chip solid crystal silver adhesive, low temperature curing conductive silver adhesive, LED solid crystal silver adhesive, isotropic conductive adhesive, semiconductor packaging silver adhesive, high temperature curing conductive silver adhesive, UV light curing adhesive