ABOUT US

Shenzhen TS Meterials Technology Co., Ltd

Shenzhen TS Meterials Technology Co., Ltd is a focus on electronic grade adhesive products and solutions of science and technology enterprises, products are widely used in electronic device protection, LED solid crystal and semiconductor packaging and other fields. The company was founded in June 2021 by a doctor of materials science with overseas background. The core team brings together a number of senior experts in the industry and has strong R & D and production capacity. At present, the company has obtained more than 20 patents, including 6 invention patents, 15 utility model patents and 4 software works patents, and has passed multiple qualification examinations such as ISO 9001, ISO 14001 and first-class quality and environmental management system certification.

In November 2021, TS Meterials was invited to settle in Guangming District Overseas Students Pioneer Park with the excellent results of the first innovation project in Guangming District. Seed round financing was completed in early 2022 and angel round investment was obtained in May 2023. Since its establishment, the company has always insisted on independent innovation and broke through the localization problem of adhesive products with high-end "stuck neck" technology. Among them, the first generation of domestic substitute products developed by the company STS-216 series of conductive silver adhesives, which overcome the last barrier in domestic substitute materials in LED industry. This product can be widely used in the fields of LED solid crystal packaging and IC semiconductor packaging. At present, it has been verified and passed by many listed benchmark customers, and completed the delivery of small batch production. Meanwhile...

2020 Year

Incorporation

30 +

Patents

2000

Laboratory area

20 +

R&D projects

Honor Certificate


The company has won honors such as a city star enterprise, top ten honest enterprises, national three-level honest enterprises, utility model enterprises, and top ten innovative enterprises.

Executive Chairman Unit
Micro small and medium-sized enterprises
Enterprise Credit Rating AAA Credit Enterprise
Enterprise Credit Rating AAA Credit Enterprise1
Service oriented and trustworthy enterprises
Quality oriented and trustworthy enterprise

2023-08-05

Selection Guide for LED Solid Crystal Materials: Advantages and Characteristics of Chip Solid Crystal Silver Adhesive

Selection Guide for LED Solid Crystal Materials: Advantages and Characteristics of Chip Solid Crystal Silver Adhesive: LED solid crystal materials play a crucial role in the modern electronic industry. Among them, chip fixed crystal silver adhesive, as a common fixed crystal material, has many unique advantages and characteristics. This article will introduce the relevant knowledge of chip fixed crystal silver adhesive and provide a guide for selecting LED fixed crystal materials to help readers better understand and choose the suitable fixed crystal materials for their own needs. Chip fixed crystal silver adhesive is a type of adhesive mainly composed of silver powder, which has conductivity and thermal conductivity, and is suitable for fixing and connecting LED chips and substrates. The following are the advantages and characteristics of chip fixed crystal silver glue: 1 Excellent thermal conductivity: The chip fixed crystal silver adhesive has excellent thermal conductivity, which can effectively transfer the heat generated by LED chips to the substrate, improve the heat dissipation effect of LED, and extend the service life of LED. 2. High strength bonding ability: Chip fixed crystal silver adhesive can firmly bond LED chips with the substrate, with good mechanical strength and vibration resistance, ensuring that LED chips are not easily detached or damaged during use. 3. Excellent conductivity: Chip fixed crystal silver adhesive has good conductivity, which can effectively conduct current and improve LED brightness

2023-09-04

Magic conductive adhesive for improving semiconductor packaging efficiency

Have you ever thought about how to improve the efficiency of semiconductor packaging with magical conductive adhesives? Now, we have a magical conductive adhesive - high conductivity silver glue, which will bring a revolution to the semiconductor packaging process. This article will introduce the characteristics and applications of this innovative product, as well as how it can improve the efficiency of semiconductor packaging. High conductivity silver adhesive has excellent conductivity and can achieve efficient conductive connections in small packaging spaces. Compared with traditional copper wire packaging, silver adhesive not only has higher conductivity, but also can provide more reliable connections. This makes the semiconductor packaging process more stable and reduces the failure rate caused by poor conductivity. In addition, high conductivity silver adhesive also has excellent heat resistance and corrosion resistance, which can adapt to various extreme environments. This magical conductive adhesive has a wide range of applications in the semiconductor packaging industry. In the chip level packaging process, high conductivity silver glue can be used to connect the chip and packaging substrate, achieving reliable signal transmission. In 3D packaging, silver glue can be used to connect multiple layers of chips, improving the integration of the packaging. In addition, high conductivity silver glue can also be used to encapsulate other electronic components, such as LEDs and sensors, to improve their performance and reliability. So, using high

2023-10-04

Low temperature curing conductive silver adhesive solution in LED packaging

Low temperature curing conductive silver adhesive is a commonly used solution in LED packaging. It has the characteristics of low hardening temperature, good conductivity, and strong adhesion, which can improve the reliability and performance of LED packaging. This article will explore the application background, characteristics, and solutions of low-temperature curing conductive silver adhesive, and focus on its application in LED packaging. LED packaging is the process of encapsulating LED chips on plastic, metal, or ceramic substrates, and is an important part of manufacturing LED lighting fixtures. And low-temperature curing conductive silver adhesive is a type of conductive adhesive used in LED packaging process. Compared to traditional high-temperature cured conductive silver adhesive, low-temperature cured conductive silver adhesive has a lower hardening temperature and can complete the curing process at lower temperatures, reducing thermal damage to LED chips and improving the reliability of the packaging process. Low temperature cured conductive silver adhesive has excellent conductivity and can effectively conduct current. It can be used to connect conductive lines between LED chips and substrates during the LED packaging process, ensuring the smooth flow of current. At the same time, low-temperature cured conductive silver adhesive also has strong adhesion, which can firmly fix LED chips on the substrate, avoiding loosening or detachment caused by vibration or temperature changes. In LED packaging, low temperature

2023-09-24

Low temperature curing conductive silver adhesive in the electronic assembly industry

Low temperature curing conductive silver adhesive plays an important role in the electronic assembly industry. This article will introduce the latest developments and applications in this field, as well as the advantages and future trends of this conductive silver adhesive. We will explore the working principle of low-temperature curing conductive silver adhesive and its importance in the electronics industry. In addition, we will also discuss the comparison of this conductive silver adhesive with other materials and analyze its use in electronic assembly. By reading this article, you will have a clearer understanding of the characteristics and applications of low-temperature cured conductive silver adhesive. In the electronic assembly industry, low-temperature curing conductive silver adhesive is widely used in circuit board connection, circuit repair, and electronic component protection. This conductive silver adhesive has excellent conductivity and bonding ability, and can cure under low temperature conditions. This special property makes it very suitable for use in electronic assembly processes, especially for temperature sensitive components and materials. The working principle of low-temperature curing conductive silver adhesive is based on the silver particles in its composition. These small silver particles have good conductivity and can form reliable conductive connections between electronic components. At low temperatures, the components in the conductive silver adhesive undergo chemical reactions, causing the accumulation of silver particles, thereby achieving the effect of conductivity. Once cured, the conductive silver adhesive will form a stable

2023-09-14

Application and advantages of low-temperature curing conductive silver adhesive

The Application and Advantages of Low Temperature Cured Conductive Silver Adhesive Conductive adhesive is a colloidal material with excellent conductivity, widely used in fields such as electronic equipment and solar panels. Low temperature cured conductive silver adhesive is a type of conductive adhesive that can quickly cure at low temperatures, with many unique advantages. This article will introduce the application and advantages of low-temperature cured conductive silver adhesive, and explore its potential in the electronics industry. One of the main applications of low-temperature cured conductive silver adhesive is in flexible electronic devices. With the continuous development of flexible electronic technology, traditional rigid electronic devices are gradually being replaced by flexible electronic devices. Low temperature cured conductive silver adhesive has become an ideal material for making flexible circuits due to its excellent conductivity and flexibility. By using low-temperature cured conductive silver adhesive, precise circuits can be made on flexible substrates, achieving efficient operation of flexible electronic devices. In addition, low-temperature curing conductive silver adhesive can also be applied in the manufacturing process of solar panels. Solar panels are devices that convert solar energy into electricity, and conductive adhesives play a crucial role in the production of solar panels. Low temperature cured conductive silver adhesive, as an efficient and low-cost conductive material, can be used for electrode preparation of solar panels to improve their conversion

2023-08-25

How to choose a high conductivity silver adhesive suitable for LED packaging

How to choose a high conductivity silver adhesive suitable for LED packaging? In today's technological development, LED products are gradually replacing traditional lighting equipment as the main light source in people's lives. In the manufacturing process of LED, high conductivity silver glue is widely used for circuit connections in LED packaging. Choosing a high conductivity silver adhesive suitable for LED packaging is an important step in ensuring product quality and performance. This article will introduce how to choose a high conductivity silver adhesive suitable for LED packaging and help you understand the relevant knowledge and skills. Firstly, understanding the characteristics and advantages of high conductivity silver adhesive is the basis for selecting suitable products. High conductivity silver glue has excellent conductivity, which can effectively conduct current, improve the performance stability and luminous efficiency of LED products. In addition, high conductivity silver adhesive also has excellent thermal conductivity and high temperature resistance, which can maintain stable performance in high temperature environments and extend the service life of LED products. Secondly, select a suitable high conductivity silver adhesive based on the specific requirements of LED packaging. LED packaging involves different processes and materials, so it is necessary to choose appropriate high conductivity silver adhesive based on different application scenarios and packaging requirements. For example, in high-power LED packaging, it is necessary to choose high thermal conductivity and high temperature resistance