Temporary masking of circuit boards
Film-forming UV peelable adhesive GS/HS series peelable adhesive is a class of low-viscosity, high cohesion UV curing adhesive, suitable for circuit boards, glass and other substrates for large-area temporary protection. The gel is a liquid with good fluidity, suitable for spin coating, scraping, screen printing, spraying and other sizing processes. The cured film has suitable adhesion, good flexibility and excellent cohesion, and the film can be peeled off completely when removing the adhesive.
Major application Suitable for large-area temporary protection of precision substrates such as circuit boards, wafer glass, metal plates, etc., as well as for use as a carrier film.
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