STS-UVA29
Classification:
Product Description
Product overview
UVA29 series is a class of ultra-high thixotropic UV curing adhesives for circuit board coating protection. The gel is a viscous gel state, with ultra-high thixotropic index, dispensing with excellent base height characteristics; at the same time, the curing depth is large, base height of the gel can be cured completely, there will be no bottom wet glue problem.
- After curing, it has lower adhesion, so it is easier to remove the glue; at the same time, it has higher cohesion and high elongation at break, so it is not easy to break the glue when removing the glue.
- It is suitable for both manual and automatic dispensing; because of its high base and good effect, it is especially suitable for mechanical automatic de-gluing.
- Viscosity and colour can be adjusted as required.
Major application
Temporary protection of precision components, etc.
Characteristic indicators | UVA29 | UVA29-NF | 竞品**888/D** |
Viscosity/mPa.s(5rpm) | ~36000 | ~34000 | ~42000 |
Thixotropic Index/TI (0.5/5rpm) | 6.5 | 6.0 | 46.9 |
Tensile strength/MPa | 4 | 3.7 | 2 |
Young's modulus/MPa | 2.6 | 2.7 | 2.6 |
Elongation at break/% | 116 | 110 | 116 |
Curing depth /mm(6000mJ) | 5.2 | 5.0 | 4.1 |
90° Peeling Force @PCB/N | 2.5 | 2.0 | 2.9 |
Key words:
UV adhesive | Conductive silver adhesive
Hotline:198-5478-9001
Email:info@szts.tech
Address: 16th Floor, Building A4, China Merchants Science Park, Guangming District
Page keywords: chip solid crystal silver adhesive, low temperature curing conductive silver adhesive, LED solid crystal silver adhesive, isotropic conductive adhesive, semiconductor packaging silver adhesive, high temperature curing conductive silver adhesive, UV light curing adhesive