STS-UVA19
Classification:
Product Description
Product overview
UVA19 is a class of UV curing adhesive with good fluidity and high cohesion, UVA20 has moderate viscosity and thixotropic index, and UVA30 has good base-high capacity, all of which are suitable for temporary masking of local plating, and are resistant to nickel-plating, gold-plating, silver-plating and other plating processes. The viscosity of the colloid has a wide range, which can be selected according to the customer's needs.
- Cured with strong adhesion; at the same time has a high cohesion, suitable fracture elongation, in addition to the glue is not easy to break the gel.
- Suitable for both manual and automatic dispensing.
- Viscosity, thixotropic index and colour can be adjusted as required.
Major application
Temporary masking of localised plating.
Characteristic indicators | UVA19 | UVA20 | UVA30 |
Viscosity/mPa.s(5rpm) | ~2200 | ~47000 | ~67000 |
Thixotropic Index/TI (0.5/5rpm) | 1.4 | 4.4 | 4.3 |
Tensile strength/MPa | 21.7 | 20.6 | 21.4 |
Young's modulus/MPa | 208 | 229 | 238 |
Elongation at break/% | 177 | 181 | 195 |
Curing depth /mm(3000mJ) | 1.5 | 1.4 | 1.4 |
90° Peeling Force @PCB/N | 12.0 | 8.4 | 7.1 |
Key words:
UV adhesive | Conductive silver adhesive
Hotline:198-5478-9001
Email:info@szts.tech
Address: 16th Floor, Building A4, China Merchants Science Park, Guangming District
Page keywords: chip solid crystal silver adhesive, low temperature curing conductive silver adhesive, LED solid crystal silver adhesive, isotropic conductive adhesive, semiconductor packaging silver adhesive, high temperature curing conductive silver adhesive, UV light curing adhesive