STS-216C

STS-216C is an epoxy conductive adhesive with high thermal conductivity and high conductivity using silver powder as the medium. It has the characteristics of high adhesive strength, strong high-temperature resistance, high reliability, good thermal conductivity, and excellent rheological properties, and is suitable for high-speed dispensing.

Classification:

Conductive silver adhesive

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Product Description

Product Overview	STS-216C is a kind of ring-gas conductive adhesive with high thermal conductivity and high electrical conductivity using silver powder as the medium. It has the characteristics of high bonding strength, high temperature resistance, high reliability, good thermal conductivity and excellent rheological properties, and is suitable for high-speed dispensing.
Main applications:	It is used in products with high thermal conductivity, high electrical conductivity and high stability requirements.
Technical Indicators	Pre-cure performance
	Project (Unit)	Test Method/Condition	data
	Type of filler		silver
	Thixotropy index	0.5 rpm / 5 rpm 25 °C	6.1
	Viscosity (CP)	Brookfield CP52，5 rpm,25 °C	18000
	Working hours	25 % increase in viscosity at 25 °C	24
	Validity period (year)	-40 °C or less	1
Curing conditions and curing process	Curing conditions are recommended
Curing conditions and curing process	3-5°C/min ramp up to 200°C + 1 hour (gradual ramp up reduces bubble generation and increases bond strength) 3-5°C/min temperature rise to 160°C + 2 hour (Zhejiang temperature increase can reduce bubble generation and increase bond strength), see curing conditions for details, thrust curve
Post-cure performance	Project (Unit)	Test Criteria/Conditions	data
	Volume resistivity (Ω∙cm)	4-point probe method	6×10-5
	Wafer shear strength (g) 3.5milx3.5mil wafer Ag/Cu	25 °C	101
	Wafer shear strength (g) 3.5milx3.5mil wafer Ag/Cu	260 °C	54
	Tg (°C)	DC (20 °C/min)	180
	Thermal conductivity (W/(m·K))	Laser flash method 121 °C	20
	Coefficient of thermal expansion below Tg (ppm/°C)	TMA expansion probe	55
	Coefficient of thermal expansion above Tg (ppm/°C)	TMA expansion probe	170
Storage and transportation	The product is stored in an environment below -40°C, and the expiration date of the product can be guaranteed under the required storage conditions. Improper storage methods can adversely affect the performance of the product.
transport	The product should be stored in dry ice during transportation to ensure that the product is kept below -40°C
thaw	thaw the product to room temperature before use; Place the needle vertically during the thawing process; Do not open the container until the product has been thawed to room temperature. When using the product, remove the condensation on the surface of the container before opening the container. For the thawing time, please refer to the product thawing temperature-time curve, and see the product thawing temperature-time curve for details
Suggestions for use	The product should be placed on the dispenser immediately after thawing. If the product needs to be transferred, it is important not to introduce impurities and air during the transfer process. The product must be used during the recommended working hours. It is not recommended to refreeze the product.
Packing specifications	Our products can be loaded into syringes or large mouth vials according to customer requirements. Pack sizes include 10g, 18g, 454g. For more information, please contact your local customer service representative.

Product thawing temperature-time curve

Product curing conditions - thrust

disclaimer

The information provided in this Technical Data Sheet (TDS) includes recommendations for the use and application of the product, which are based on product knowledge and experience as of the date of generation of this TDS. The product can be used in a variety of different applications, as well as in different working environments and processes that are beyond our control, as well as different applications and operating conditions beyond our control. Therefore, we do not accept any responsibility for the suitability of the product for your production process and conditions and for its intended use. We recommend that you conduct pre-production testing according to your own operating methods and process conditions to ensure the suitability of our products. We are not responsible for the information in this Technical Data Sheet (TDS) or any other written or oral advice regarding the relevant product.

Key words:

UV adhesive | Conductive silver adhesive