STS-216B
Classification:
Product Description
Product Overview | STS-216B is an epoxy conductive adhesive with silver powder as the medium. It has the characteristics of high bonding strength, high temperature resistance, high reliability, good thermal conductivity, high thixotropy, excellent rheological properties, etc., and is suitable for high-speed dispensing. Good operability. | ||
Main applications: | High-speed dispensing equipment for die attach processes. | ||
Technical Indicators | Pre-cure performance | ||
Project (Unit) | Test Method/Condition | data | |
Type of filler | silver | ||
Thixotropy index | 0.5 rpm / 5 rpm 25 °C | 6.4 | |
Viscosity (cP) | Brookfield CP52,5 rpm, 25 °C | 12000 | |
Working hours | 25% increase in viscosity at 25 °C | 24 | |
Validity period (year) | Below -40°C | 1 | |
Curing conditions and curing process | 3-5°C/min ramp up to 150C + constant temperature for 1.5 hour (gradual ramp up reduces bubble generation and increases bond strength) | ||
Post-cure performance | Project (Unit) | Test Criteria/Conditions | data |
Volume resistivity (Ω∙cm)
|
4-point probe method
|
6×10-5
|
|
Wafer shear strength (g) 3.5milx3.5mil wafer Ag/Cu | 25 °C | 68 | |
260 °C | 40 | ||
Tg (°C) | TMA | 142 | |
Thermal conductivity (W/(m·K)) | Laser flash method 121 °C | 5.0 | |
Coefficient of thermal expansion below Tg (ppm/°C) | TMA expansion probe | 48 | |
Coefficient of thermal expansion above Tg (ppm/°C) | TMA expansion probe | 159 | |
Storage and transportation | The product is stored in an environment below -40°C, and the expiration date of the product can be guaranteed under the required storage conditions. Improper storage methods can adversely affect the performance of the product. | ||
transport | The product should be stored in dry ice during transportation to ensure that the product is kept below -40C. | ||
thaw | thaw the product to room temperature before use; Place the needle vertically during the thawing process, and do not open the container until the product has been thawed to room temperature. When using the product, remove the condensation on the surface of the container before opening the container. For the thawing time, please refer to the product thawing temperature-time curve, and see the product thawing temperature-time curve for details | ||
Suggestions for use | The product should be placed on the dispenser immediately after thawing. If the product needs to be transferred, it is important not to introduce impurities and air during the transfer process. The product must be used during the recommended working hours. It is not recommended to refreeze the product. | ||
Packing specifications | Our products can be loaded into syringes or large mouth vials according to customer requirements. Pack sizes include 10 grams, 18 grams and 454 grams. For more information, please contact your local customer service representative. |
Product thawing temperature-time curve
disclaimer
The information provided in this Technical Data Sheet (TDS) includes recommendations for the use and application of the product, which are based on product knowledge and experience as of the date of generation of this TDS. The product can be used in a variety of different applications, as well as in different working environments and processes that are beyond our control, as well as different applications and operating conditions beyond our control. Therefore, we do not accept any responsibility for the suitability of the product for your production process and conditions and for its intended use. We recommend that you conduct pre-production testing according to your own operating methods and process conditions to ensure the suitability of our products. We are not responsible for the information in this Technical Data Sheet (TDS) or any other written or oral advice regarding the relevant product.
Key words:
UV adhesive | Conductive silver adhesive