LED commercial display Min Moc packaging
LED packaging technology is mostly developed and evolved on the basis of discrete device packaging technology, but it has great particularity. In general, the cores of discrete devices are sealed within the packaging body, and the main function of the packaging is to protect the cores and complete electrical interconnection. LED packaging, on the other hand, is the function of outputting electrical signals, protecting the normal operation of the tube core, and outputting visible light. It has both electrical and optical parameters and technical requirements, making it impossible to simply use packaging of discrete devices for LEDs.
Surface mount packaging
In 2002, surface mount packaged LEDs (SMDLED) were gradually accepted by the market and gained a certain market share. The shift from pin based packaging to SMD was in line with the overall trend of the electronics industry, and many manufacturers launched such products.
Early SMD LEDs mostly used improved SOT-23 with transparent plastic bodies, and were packaged in reel type containers with tape. On the basis of SOT-23, the former emits monochromatic light, while the latter emits bicolor or tricolor light. In recent years, SMD LED has become a development hotspot, effectively solving problems such as brightness, viewing angle, flatness, scalability, and consistency. By using lighter PCB boards and reflective layer materials, less epoxy resin needs to be filled in the display reflective layer, and heavier carbon steel material guides are removed. By reducing size and weight, the product weight can be easily reduced by half, ultimately making the application more perfect, especially suitable for indoor use, Semi outdoor full color display screen application.
Table 3 shows several common sizes of SMD LEDs and the optimal viewing distance calculated based on the dimensions (plus necessary gaps). Solder pads are an important channel for heat dissipation, and the data provided by manufacturers for SMD LEDs is based on 4.0 × Based on a 4.0mm solder pad, reflow soldering can be designed so that the solder pad is equal to the pin. Ultra high brightness LED products can be packaged using PLCC (plastic encapsulated lead chip carrier) -2, and high brightness tube cores can be assembled using a unique method. The product has a thermal resistance of 400K/W and can be welded according to CECC method. Its luminous intensity is 1250mcd at a driving current of 50mA. The character height of seven segment one digit, two digit, three digit, and four digit digital SMD LED display devices is 12.7mm, and the display size selection range is wide. The PLCC packaging avoids the manual insertion and pin alignment processes required for pin seven segment digital displays, meeting the production requirements of automatic pickup mounting equipment. The application design space is flexible, and the display is bright and clear. The multi-color PLCC package comes with an external reflector that can be easily combined with light-emitting tubes or photoconductors. Reflective optical design is used instead of transmissive optical design, providing unified lighting for a wide range of areas. The power SMD LED package is developed to operate under 3.5V, 1A driving conditions.
Power type packaging
LED chips and packaging are developing towards high-power, resulting in higher power output under high current conditions Φ A 5mm LED has a luminous flux of 10-20 times larger, and effective heat dissipation and non deteriorating packaging materials must be used to solve the problem of light attenuation. Therefore, the shell and packaging are also key technologies, and LED packaging that can withstand several watts of power has emerged. 5W series
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