IC package
IC packaging refers to the process of connecting circuit pins on a silicon chip to external connectors with wires for connection with other devices. Packaging form refers to the outer shell used for installing semiconductor integrated circuit chips. It not only plays a role in installation, fixation, sealing, protecting the chip, and enhancing the electric heating performance, but also connects to the pins of the packaging shell through the contacts on the chip using wires. These pins are connected to other devices through wires on the printed circuit board, thus achieving the connection between the internal chip and external circuits. Because the chip must be isolated from the outside world to prevent impurities in the air from corroding the chip circuit and causing a decrease in electrical performance.
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